2026 추계 소음진동 학술대회2026. 11. 25.(수) ~ 28.(토)여수 엑스포컨벤션센터
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POSTERP207

Mechanics of Sequential Compliance Transfer in Series-Stacked QZS Modules

W
발표자

일시11/27 금 · 10:00~10:40

발표장컨퍼런스홀

저자
Wang Yuhao, 오일권(KAIST), Patro Somya Ranjan, 양석규, 양진규(서울대), Kangyu Li, Zhihao Yuan, Jaehyung Ju(상하이교통대), Arup Neogi(중국전자과기대)
소속
KAIST, 서울대, 상하이교통대, 중국전자과기대
세션
포스터 발표 [2]
좌장
김성현(현대차), 박춘수(표준과학연), 박현우(동아대), 손기성(세안기술)

키워드

확장요약문

A passive series-stacked quasi-zero-stiffness (QZS) architecture composed of three origami-inspired Sarrus modules and unilateral stoppers is formulated to study sequential compliance transfer under predefined load states. The central question is when incremental deformation localizes in one module rather than spreading across the stack. A contact-set-dependent common-force model combines stable inverse branches, a displacement-share criterion, stopper placement, inter-stage force ordering, and contact reserve. An analytical tangent-stiffness result shows that, at fixed geometry and natural spring length, spring rate rescales force but does not shift the zero-tangent displacement. Using the archived single-spring inputs, predicted module peaks are 3.81, 10.37, and 21.42 N, versus three-repeat mean recorded peaks of 1.98, 6.53, and 13.24 N; because displacement registration is unverified, this comparison is treated as model discrepancy rather than validation. Assumed-parameter vibration examples compare mean-shift harmonic balance with direct integration and test a reduced active-stage model against a distributed fixed-state stack. The reduction is accurate only over a frequency-dependent range and is sensitive to contacted-layer stiffness. Static evidence comprises three fixed-assembly repeats per module and one global stack record, while each dynamic configuration has five processed response-ratio curves. Because module-resolved displacement and stopper contact were not measured, the study establishes testable mechanics conditions for sequential compliance transfer rather than a validated prototype operating envelope.

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